ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,859, issued on April 21, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and manufacturing method there... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,860, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Multi-chip stacking method" was invented b... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,861, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-do, South Korea). "Display device and method of manufacturing ... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,862, issued on April 21, was assigned to Rambus Inc. (San Jose, Calif.). "Reliability for DRAM device stack" was invented by Dongyun Lee (... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,863, issued on April 21, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris). "Interactive display devi... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,864, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Junya Sakai (Tokyo) and... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Semiconductor device and method... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,867, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Young Min Par... और पढ़ें
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out stacked semiconductor package s... और पढ़ें